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Communication dans un congrès

3D Reconstruction from Specialized Wide Field of View Camera System Using Unified Spherical Model

Ahmad Zawawi Jamaluddin 1, * Cansen Jiang 2, 1, * Olivier Morel 1, * Ralph Seulin 2, 1, * D. Fofi 1, * 
* Auteur correspondant
1 Le2i - Laboratoire d'Electronique, d'Informatique et d'Image [EA 7508]
2 Le2i - Laboratoire Electronique, Informatique et Image [UMR6306]
Abstract : This paper proposed a method of three dimensions (3D) reconstruction from a wide field of view(FoV) camera system. This camera system consists of two fisheye cameras each with 180 degrees FoV. The fisheye cameras placed back to back to obtain a full 360 degrees FoV. A stereo vision camera is placed to estimate the depth information of anterior view of the camera system. A novel calibration method using unified camera model representation has been proposed to calibrate the multiple camera systems. An effective fusion algorithm has been introduced to fuse multi-camera images by exploiting the overlapping area. Moreover, direct and fast 3D reconstruction of sparse feature matches based on the spherical representation are obtained using the proposed system.
Keywords : Fisheye camera calibration Unified spherical model 3D reconstruction Interior Point Optimization algorithm Omnidirectional Cameras
Type de document :
Communication dans un congrès
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https://hal-univ-bourgogne.archives-ouvertes.fr/hal-01890313
Contributeur : LE2I - université de Bourgogne Connectez-vous pour contacter le contributeur
Soumis le : lundi 8 octobre 2018 - 15:06:38
Dernière modification le : vendredi 5 août 2022 - 14:54:00

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UNIV-BOURGOGNE | CNRS | UNIV-BM | LE2I | UNIV-BM-THESE | IMVIA | VIBOT | ARTS-ET-METIERS-SCIENCES-ET-TECHNOLOGIES

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Ahmad Zawawi Jamaluddin, Cansen Jiang, Olivier Morel, Ralph Seulin, D. Fofi. 3D Reconstruction from Specialized Wide Field of View Camera System Using Unified Spherical Model. 19th International Conference on Image Analysis and Processing (ICIAP), Univ Catania, Dept Math & Comp Sci, Image Proc Lab; iCTLab; Micron; STMicroelectronics, Sep 2017, Catania, Italy. pp.495-506, ⟨10.1007/978-3-319-68560-1_44⟩. ⟨hal-01890313⟩

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